Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel. Integration of intra chip stack fluidic cooling using thin-layer solder bonding. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]
Abstract is missing.