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Advances and Challenges in Flip-Chip Packaging

R. Mahajan, D. Mallik, R. Sankman, K. Radhakrishnan, C. Chiu, J. He. Advances and Challenges in Flip-Chip Packaging. In Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006, DoubleTree Hotel, San Jose, California, USA, September 10-13, 2006. pages 703-709, IEEE, 2006. [doi]

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R. Mahajan

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D. Mallik

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R. Sankman

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K. Radhakrishnan

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C. Chiu

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J. He

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