R. Mahajan, D. Mallik, R. Sankman, K. Radhakrishnan, C. Chiu, J. He. Advances and Challenges in Flip-Chip Packaging. In Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006, DoubleTree Hotel, San Jose, California, USA, September 10-13, 2006. pages 703-709, IEEE, 2006. [doi]
@inproceedings{MahajanMSRCH06,
title = {Advances and Challenges in Flip-Chip Packaging},
author = {R. Mahajan and D. Mallik and R. Sankman and K. Radhakrishnan and C. Chiu and J. He},
year = {2006},
doi = {10.1109/CICC.2006.320896},
url = {http://dx.doi.org/10.1109/CICC.2006.320896},
researchr = {https://researchr.org/publication/MahajanMSRCH06},
cites = {0},
citedby = {0},
pages = {703-709},
booktitle = {Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006, DoubleTree Hotel, San Jose, California, USA, September 10-13, 2006},
publisher = {IEEE},
isbn = {1-4244-0075-9},
}