TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs

Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri. TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 40(8):1500-1510, 2021. [doi]

Abstract

Abstract is missing.