Pad Assignment for Die-Stacking System-in-Package Design

Wai-Kei Mak, Yu-Chen Lin, Chris Chu, Ting-Chi Wang. Pad Assignment for Die-Stacking System-in-Package Design. IEEE Trans. on CAD of Integrated Circuits and Systems, 31(11):1711-1722, 2012. [doi]

Authors

Wai-Kei Mak

This author has not been identified. Look up 'Wai-Kei Mak' in Google

Yu-Chen Lin

This author has not been identified. Look up 'Yu-Chen Lin' in Google

Chris Chu

This author has not been identified. Look up 'Chris Chu' in Google

Ting-Chi Wang

This author has not been identified. Look up 'Ting-Chi Wang' in Google