Wai-Kei Mak, Yu-Chen Lin, Chris Chu, Ting-Chi Wang. Pad Assignment for Die-Stacking System-in-Package Design. IEEE Trans. on CAD of Integrated Circuits and Systems, 31(11):1711-1722, 2012. [doi]
@article{MakLCW12,
title = {Pad Assignment for Die-Stacking System-in-Package Design},
author = {Wai-Kei Mak and Yu-Chen Lin and Chris Chu and Ting-Chi Wang},
year = {2012},
doi = {10.1109/TCAD.2012.2202395},
url = {http://dx.doi.org/10.1109/TCAD.2012.2202395},
researchr = {https://researchr.org/publication/MakLCW12},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {31},
number = {11},
pages = {1711-1722},
}