Sandeep Mallampati, Zaeem Baig, Scott Pozder, Eng Chye Chua. A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package. In IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.