Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl. Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability, 44(5):797-803, 2004. [doi]

Authors

Dionysios Manessis

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Rainer Patzelt

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Andreas Ostmann

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Rolf Aschenbrenner

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Herbert Reichl

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