Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl. Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability, 44(5):797-803, 2004. [doi]
@article{ManessisPOAR04,
title = {Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping},
author = {Dionysios Manessis and Rainer Patzelt and Andreas Ostmann and Rolf Aschenbrenner and Herbert Reichl},
year = {2004},
doi = {10.1016/S0026-2714(03)00361-5},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00361-5},
researchr = {https://researchr.org/publication/ManessisPOAR04},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {44},
number = {5},
pages = {797-803},
}