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Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl. Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability, 44(5):797-803, 2004. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Bump formation for flip chip and CSP by solder paste printingJoachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl. mr, 42(3):391-398, 2002. [doi]
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