Thermal-aware reliability analysis for platform FPGAs

Prasanth Mangalagiri, Sungmin Bae, Krishnan Ramakrishnan, Yuan Xie, Vijaykrishnan Narayanan. Thermal-aware reliability analysis for platform FPGAs. In Sani R. Nassif, Jaijeet S. Roychowdhury, editors, 2008 International Conference on Computer-Aided Design (ICCAD 08), November 10-13, 2008, San Jose, CA, USA. pages 722-727, IEEE, 2008. [doi]

@inproceedings{MangalagiriBKXN08,
  title = {Thermal-aware reliability analysis for platform FPGAs},
  author = {Prasanth Mangalagiri and Sungmin Bae and Krishnan Ramakrishnan and Yuan Xie and Vijaykrishnan Narayanan},
  year = {2008},
  doi = {10.1145/1509456.1509613},
  url = {http://doi.acm.org/10.1145/1509456.1509613},
  tags = {analysis, context-aware, reliability},
  researchr = {https://researchr.org/publication/MangalagiriBKXN08},
  cites = {0},
  citedby = {0},
  pages = {722-727},
  booktitle = {2008 International Conference on Computer-Aided Design (ICCAD 08), November 10-13, 2008, San Jose, CA, USA},
  editor = {Sani R. Nassif and Jaijeet S. Roychowdhury},
  publisher = {IEEE},
  isbn = {978-1-4244-2820-5},
}