TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning - researchr publication authors

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Kanchan Manna, Vadapalli Shanmukha Sri Teja, Santanu Chattopadhyay, Indranil Sengupta. TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning. In 2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015. pages 392-397, IEEE Computer Society, 2015. [doi]

This author has not been identified. Look up 'Kanchan Manna' in GoogleThis author has not been identified. Look up 'Vadapalli Shanmukha Sri Teja' in GoogleThis author has not been identified. Look up 'Santanu Chattopadhyay' in GoogleThis author has not been identified. Look up 'Indranil Sengupta' in Google

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