Kanchan Manna, Vadapalli Shanmukha Sri Teja, Santanu Chattopadhyay, Indranil Sengupta. TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning. In 2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015. pages 392-397, IEEE Computer Society, 2015. [doi]
@inproceedings{MannaTCS15,
title = {TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning},
author = {Kanchan Manna and Vadapalli Shanmukha Sri Teja and Santanu Chattopadhyay and Indranil Sengupta},
year = {2015},
doi = {10.1109/ISVLSI.2015.9},
url = {http://dx.doi.org/10.1109/ISVLSI.2015.9},
researchr = {https://researchr.org/publication/MannaTCS15},
cites = {0},
citedby = {0},
pages = {392-397},
booktitle = {2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015},
publisher = {IEEE Computer Society},
isbn = {978-1-4799-8719-1},
}