TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning - researchr publication

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Kanchan Manna, Vadapalli Shanmukha Sri Teja, Santanu Chattopadhyay, Indranil Sengupta. TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin Partitioning. In 2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015. pages 392-397, IEEE Computer Society, 2015. [doi]

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