Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht. Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. Microelectronics Reliability, 84:197-207, 2018. [doi]

Authors

Subramani Manoharan

This author has not been identified. Look up 'Subramani Manoharan' in Google

Chandradip Patel

This author has not been identified. Look up 'Chandradip Patel' in Google

F. Patrick McCluskey

This author has not been identified. Look up 'F. Patrick McCluskey' in Google

Michael G. Pecht

This author has not been identified. Look up 'Michael G. Pecht' in Google