Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht. Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. Microelectronics Reliability, 84:197-207, 2018. [doi]

Abstract

Abstract is missing.