Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht. Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. Microelectronics Reliability, 84:197-207, 2018. [doi]
@article{ManoharanPMP18,
title = {Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment},
author = {Subramani Manoharan and Chandradip Patel and F. Patrick McCluskey and Michael G. Pecht},
year = {2018},
doi = {10.1016/j.microrel.2018.03.028},
url = {https://doi.org/10.1016/j.microrel.2018.03.028},
researchr = {https://researchr.org/publication/ManoharanPMP18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {84},
pages = {197-207},
}