Investigation on Contacts Thermal Stability for 3D Sequential Integration

S. J. Mao, J. B. Liu, Y. Wang, W. B. Liu, Y. P. Hu, H. W. Cui, R. Zhang, H. C. Liu, Z. X. Wang, N. Zhou, Y. K. Zhang, H. Yang, Z. H. Wu, Y.-L. Li, J. F. Gao, A. Y. Du, J. F. Li, J. Luo, W.-W. Wang, H. X. Yin. Investigation on Contacts Thermal Stability for 3D Sequential Integration. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 37-1, IEEE, 2022. [doi]

Abstract

Abstract is missing.