Sravan K. Marella, Sanjay V. Kumar, Sachin S. Sapatnekar. A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations. In 2012 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2012, San Jose, CA, USA, November 5-8, 2012. pages 317-324, IEEE, 2012. [doi]
Abstract is missing.