A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper

Erik Jan Marinissen, Chun-Chuan Chi, Mario H. Konijnenburg, Jouke Verbree. A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper. J. Electronic Testing, 28(1):73-92, 2012. [doi]

Abstract

Abstract is missing.