Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits - researchr publication authors

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Erik Jan Marinissen, Ferenc Fodor, Arnita Podpod, Michele Stucchi, Yu-Rong Jian, Cheng-Wen Wu. Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. In IEEE International Test Conference, ITC 2018, Phoenix, AZ, USA, October 29 - Nov. 1, 2018. pages 1-10, IEEE, 2018. [doi]

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