Erik Jan Marinissen, Ferenc Fodor, Arnita Podpod, Michele Stucchi, Yu-Rong Jian, Cheng-Wen Wu. Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. In IEEE International Test Conference, ITC 2018, Phoenix, AZ, USA, October 29 - Nov. 1, 2018. pages 1-10, IEEE, 2018. [doi]
@inproceedings{MarinissenFPSJW18,
title = {Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits},
author = {Erik Jan Marinissen and Ferenc Fodor and Arnita Podpod and Michele Stucchi and Yu-Rong Jian and Cheng-Wen Wu},
year = {2018},
doi = {10.1109/TEST.2018.8624731},
url = {https://doi.org/10.1109/TEST.2018.8624731},
researchr = {https://researchr.org/publication/MarinissenFPSJW18},
cites = {0},
citedby = {0},
pages = {1-10},
booktitle = {IEEE International Test Conference, ITC 2018, Phoenix, AZ, USA, October 29 - Nov. 1, 2018},
publisher = {IEEE},
isbn = {978-1-5386-8382-8},
}