Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Fumiaki Yamada. Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
Abstract is missing.