Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii. Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-6, IEEE, 2014. [doi]
@inproceedings{MatsumotoMO14,
title = {Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack},
author = {Keiji Matsumoto and Hiroyuki Mori and Yasumitsu Orii},
year = {2014},
doi = {10.1109/3DIC.2014.7152164},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152164},
researchr = {https://researchr.org/publication/MatsumotoMO14},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}