Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii. Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-6, IEEE, 2014. [doi]
Abstract is missing.