Laura B. Mauer, John Taddei, Elena Lawrence, Ramey Youssef, Stephen P. Olson. Silicon Etch with integrated metrology for through silicon via (TSV) reveal. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
Abstract is missing.