J. M. McGlone, Guy Brizar, Daniel Vanderstraeten, D. Iyer, S. Hose, J. P. Gambino. Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-5, IEEE, 2020. [doi]
Abstract is missing.