Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown

J. W. McPherson. Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown. Microelectronics Reliability, 44(9-11):1491-1496, 2004. [doi]

Authors

J. W. McPherson

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