J. W. McPherson. Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown. Microelectronics Reliability, 44(9-11):1491-1496, 2004. [doi]
@article{McPherson04,
title = {Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown},
author = {J. W. McPherson},
year = {2004},
doi = {10.1016/j.microrel.2004.07.045},
url = {http://dx.doi.org/10.1016/j.microrel.2004.07.045},
researchr = {https://researchr.org/publication/McPherson04},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {44},
number = {9-11},
pages = {1491-1496},
}