J. W. McPherson. Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown. Microelectronics Reliability, 44(9-11):1491-1496, 2004. [doi]
@article{McPherson04, title = {Mie-Grüneisen Analysis of the Molecular Bonding States in Silica Which Impact Time-Dependent Dielectric Breakdown}, author = {J. W. McPherson}, year = {2004}, doi = {10.1016/j.microrel.2004.07.045}, url = {http://dx.doi.org/10.1016/j.microrel.2004.07.045}, researchr = {https://researchr.org/publication/McPherson04}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {44}, number = {9-11}, pages = {1491-1496}, }