System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

Rafael Medina, Joshua Kein, Giovanni Ansaloni, Marina Zapater, Sergi Abadal, Eduard Alarcón, David Atienza. System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms. In Atsushi Takahashi 0001, editor, Proceedings of the 28th Asia and South Pacific Design Automation Conference, ASPDAC 2023, Tokyo, Japan, January 16-19, 2023. pages 561-566, ACM, 2023. [doi]

Abstract

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