Providing a High-Performance VIA-Module for LAM/MPI

Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel. Providing a High-Performance VIA-Module for LAM/MPI. In 2004 International Conference on Parallel Computing in Electrical Engineering (PARELEC 2004), 7-10 September 2004, Dresden, Germany. pages 277-282, IEEE Computer Society, 2004. [doi]

Authors

Torsten Mehlan

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Wolfgang Rehm

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Ralph Engler

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Tobias Wenzel

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