Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel. Providing a High-Performance VIA-Module for LAM/MPI. In 2004 International Conference on Parallel Computing in Electrical Engineering (PARELEC 2004), 7-10 September 2004, Dresden, Germany. pages 277-282, IEEE Computer Society, 2004. [doi]
@inproceedings{MehlanREW04,
title = {Providing a High-Performance VIA-Module for LAM/MPI},
author = {Torsten Mehlan and Wolfgang Rehm and Ralph Engler and Tobias Wenzel},
year = {2004},
url = {http://csdl.computer.org/comp/proceedings/parelec/2004/2080/00/20800277abs.htm},
researchr = {https://researchr.org/publication/MehlanREW04},
cites = {0},
citedby = {0},
pages = {277-282},
booktitle = {2004 International Conference on Parallel Computing in Electrical Engineering (PARELEC 2004), 7-10 September 2004, Dresden, Germany},
publisher = {IEEE Computer Society},
isbn = {0-7695-2080-4},
}