Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel. Providing a High-Performance VIA-Module for LAM/MPI. In 2004 International Conference on Parallel Computing in Electrical Engineering (PARELEC 2004), 7-10 September 2004, Dresden, Germany. pages 277-282, IEEE Computer Society, 2004. [doi]
Abstract is missing.