Jean-Marc Le Meil, Bernard Aspar, Eric Desbonnets, Jean-Pierre Raskin. Engineered substrates: The foundation to meet current and future RF requirements. In VLSI Design, Automation and Test, VLSI-DAT 2015, Hsinchu, Taiwan, April 27-29, 2015. pages 1-4, IEEE, 2015. [doi]
Abstract is missing.