Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs

Melamed, Samson, Thorolfsson, Thorlindur, Adi Srinivasan, Cheng, Edmund, Franzon, Paul, Davis, W. Rhett. Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-6, 2010.

@article{Melamed,
  title = {Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs},
  author = {Melamed, Samson and Thorolfsson, Thorlindur and Adi Srinivasan and Cheng, Edmund and Franzon, Paul and Davis, W. Rhett},
  year = {2010},
  url = {http://ieeexplore.ieee.org/xpl/freeabs\_all.jsp?arnumber=5636308},
  tags = {layout, meta-model, analysis, logic, Meta-Environment, design, process modeling},
  researchr = {https://researchr.org/publication/Melamed},
  cites = {0},
  citedby = {0},
  journal = {Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on},
  pages = {1-6},
}