Jorge Mendoza, Jimmy-Bao Le, Choong-Un Kim, Hung-Yun Lin. Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-6, IEEE, 2023. [doi]
Abstract is missing.