TSV-virtualization for Multi-protocol-Interconnect in 3D-ICs

Felix Miller, Thomas Wild, Andreas Herkersdorf. TSV-virtualization for Multi-protocol-Interconnect in 3D-ICs. In 15th Euromicro Conference on Digital System Design, DSD 2012, Cesme, Izmir, Turkey, September 5-8, 2012. pages 374-381, IEEE, 2012. [doi]

@inproceedings{MillerWH12,
  title = {TSV-virtualization for Multi-protocol-Interconnect in 3D-ICs},
  author = {Felix Miller and Thomas Wild and Andreas Herkersdorf},
  year = {2012},
  doi = {10.1109/DSD.2012.135},
  url = {http://dx.doi.org/10.1109/DSD.2012.135},
  researchr = {https://researchr.org/publication/MillerWH12},
  cites = {0},
  citedby = {0},
  pages = {374-381},
  booktitle = {15th Euromicro Conference on Digital System Design, DSD 2012, Cesme, Izmir, Turkey, September 5-8, 2012},
  publisher = {IEEE},
  isbn = {978-1-4673-2498-4},
}