TSV-virtualization for Multi-protocol-Interconnect in 3D-ICs

Felix Miller, Thomas Wild, Andreas Herkersdorf. TSV-virtualization for Multi-protocol-Interconnect in 3D-ICs. In 15th Euromicro Conference on Digital System Design, DSD 2012, Cesme, Izmir, Turkey, September 5-8, 2012. pages 374-381, IEEE, 2012. [doi]

Abstract

Abstract is missing.