Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, D. Abdi, Herman Oprins, D. Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, J. Myers, Francky Catthoor, Julien Ryckaert. Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-7, IEEE, 2023. [doi]
@inproceedings{MishraVVBLAOBZHPWHMCR23,
title = {Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)},
author = {Subrat Mishra and Sankatali Venkateswarlu and Bjorn Vermeersch and Moritz Brunion and Melina Lofrano and D. Abdi and Herman Oprins and D. Biswas and Odysseas Zografos and Gaspard Hiblot and Geert Van der Plas and Pieter Weckx and Geert Hellings and J. Myers and Francky Catthoor and Julien Ryckaert},
year = {2023},
doi = {10.1109/IRPS48203.2023.10117979},
url = {https://doi.org/10.1109/IRPS48203.2023.10117979},
researchr = {https://researchr.org/publication/MishraVVBLAOBZHPWHMCR23},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-5672-2},
}