Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, D. Abdi, Herman Oprins, D. Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, J. Myers, Francky Catthoor, Julien Ryckaert. Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-7, IEEE, 2023. [doi]

Abstract

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