Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Takayasu Sakurai, Tadahiro Kuroda. A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package. J. Solid-State Circuits, 41(1):23-34, 2006. [doi]
Abstract is missing.