Tsukasa Miura, Masaki Sakakibara, Hirotsugu Takahashi, Tadayuki Taura, Keiji Tatani, Yusuke Oike, Takayuki Ezaki. A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-2, IEEE, 2019. [doi]
@inproceedings{MiuraSTTTOE19,
title = {A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections},
author = {Tsukasa Miura and Masaki Sakakibara and Hirotsugu Takahashi and Tadayuki Taura and Keiji Tatani and Yusuke Oike and Takayuki Ezaki},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058832},
url = {https://doi.org/10.1109/3DIC48104.2019.9058832},
researchr = {https://researchr.org/publication/MiuraSTTTOE19},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}