Tsukasa Miura, Masaki Sakakibara, Hirotsugu Takahashi, Tadayuki Taura, Keiji Tatani, Yusuke Oike, Takayuki Ezaki. A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-2, IEEE, 2019. [doi]
Abstract is missing.