Nobuaki Miyakawa. A 3D prototyping chip based on a wafer-level stacking technology. In Proceedings of the 14th Asia South Pacific Design Automation Conference, ASP-DAC 2009, Yokohama, Japan, January 19-22, 2009. pages 416-420, IEEE, 2009. [doi]
@inproceedings{Miyakawa09,
title = {A 3D prototyping chip based on a wafer-level stacking technology},
author = {Nobuaki Miyakawa},
year = {2009},
doi = {10.1145/1509633.1509736},
url = {http://doi.acm.org/10.1145/1509633.1509736},
tags = {rule-based},
researchr = {https://researchr.org/publication/Miyakawa09},
cites = {0},
citedby = {0},
pages = {416-420},
booktitle = {Proceedings of the 14th Asia South Pacific Design Automation Conference, ASP-DAC 2009, Yokohama, Japan, January 19-22, 2009},
publisher = {IEEE},
isbn = {978-1-4244-2748-2},
}