Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling

Hitoshi Mizunuma, Yi-Chang Lu, Chia-Lin Yang. Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling. IEEE Trans. on CAD of Integrated Circuits and Systems, 30(9):1293-1306, 2011. [doi]

Abstract

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