Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects

Jingcheng Mo, Chunyue Huang, Chao Gao, Gui Wang. Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects. Microelectronics Journal, 165:106838, 2025. [doi]

Abstract

Abstract is missing.