Hariram Mohanram, Harikrishnan Kumarasamy, Choong-Un Kim, Young Joon Park, Sudarshan Prasad, Srikanth Krishnan. Thermomechanical Fatigue in Two Level Cu Interconnects Under Pulsing Peak Current. In IEEE International Reliability Physics Symposium, IRPS 2025, Monterey, CA, USA, March 30 - April 3, 2025. pages 42, IEEE, 2025. [doi]
Abstract is missing.