Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

Saikat Mondal, Sang-Bock Cho, Bruce C. Kim. Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding. IEEE Trans. VLSI Syst., 25(1):308-318, 2017. [doi]

Abstract

Abstract is missing.