Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction - researchr publication authors

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Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo. Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]

This author has not been identified. Look up 'Makoto Motoyoshi' in GoogleThis author has not been identified. Look up 'Kohki Yanagimura' in GoogleThis author has not been identified. Look up 'Taikoh Fushimi' in GoogleThis author has not been identified. Look up 'Shunta Endo' in Google

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