Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo. Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
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